Hefei Huayu added a three temperature probe table that can test 8-12 inch wafers, which can realize temperature test (- 55 ℃ ^ 200 ℃). The circuit module with a core size of 0.2 * 0.2 can test up to 1 million pieces. This equipment is used in advanced OTS position processing system and color wafer image alignment system, and has the function of small maximum magnification for equipment. It is a high-precision and operable equipment.
Hefei Huayu Semiconductor Co., Ltd. provides customers with 6 inch, 8 inch, 12 inch wafer testing and finished chip testing services of SOP, TSSOP, QFN, DFN, LQFP and other specifications, covering CPU, MCU, FPGA, SOC chips, RF chips, memory chips, sensor chips, power chips and other types of chips to meet the needs of mass IC R&D testing and mass production testing. It aims to provide advanced integrated circuit test services to customers all over the world.
