On March 21, the construction of Hefei integrated circuit testing industry center was officially started, which will add “chip” strength to the development of integrated circuit industry in the high-tech zone.
The project is “customized” by Hefei Hisemi Semiconductor Co., Ltd., a key investment attraction enterprise in Hefei high tech Zone, and is constructed by Hefei High Tech Co., Ltd. The project is located in the northeast corner of Xuetian road and Ningxi Road, covering an area of about 41 mu, with a total construction area of about 50000 square meters. It mainly builds production workshops, assembly workshops and related supporting service facilities. It is planned to be completed and delivered in May 2023. After the project is completed and put into operation, it can form a high-end integrated circuit chip testing capacity including 90000 pieces / month of integrated circuit 8-inch and 12 inch wafer testing, and 100million pieces / month of integrated circuit finished product testing. It can provide 8-inch and 12 inch wafer testing and SOP, tssop, QFN, BGA, SIP and other standardized chip finished product testing services to meet the needs of large-scale IC R & D testing and mass production testing, We will further promote the development of the industrial chain of Hefei integrated circuits in pre packaging wafer testing and post packaging finished product testing, and play a role of “extending, supplementing and strengthening the chain”.
As the core bearing area of the development of integrated circuit industry in Hefei, in recent years, the development of integrated circuit industry in Hefei high tech Zone has achieved remarkable results. After the completion and delivery of the integrated circuit packaging and testing industrial park constructed and operated by Hefei High Tech Co., Ltd. in December 2020, it has attracted many integrated circuit related enterprises such as Hefei Ruihe technology, Hefei onst technology, century golden light, purple uniform light constant, etc. to settle in and put into production, with a signing entry rate of 100% and an annual output value of 500 million yuan; The integrated circuit headquarters base in Hefei high tech Zone, with a total investment of 1.8 billion yuan and a total construction area of 334000 square meters, is undergoing curtain wall construction. It is planned to be completed and put into use in December 2022. After completion, it will focus on the introduction of enterprises related to the upstream and downstream industrial chain of integrated circuit chips and sensors, design and development, packaging and testing, smart phones, Internet of things and other terminal applications, and strive to build an advanced integrated circuit industrial base.
