Reliability verification and testing
In order to understand, evaluate, improve and analyze the reliability level of the product, the potential defects of the product are exposed by simulating the stress conditions in the actual working environment of the product, and the relevant product reliability feature information is obtained, so as to improve and verify the reliability level of the product. During the whole life cycle of a product, its reliability is not only affected by the design and manufacturing stages, but also constrained by the management level and test capability. Product reliability test plays an important role in ensuring that the reliability of products meets the reliability requirements of design.
Tester system
TCT：Temperature Cycling Test
Experimental project ：
High and low temperature cycle
High temperature storage
Cryogenic storage
Experimental ability:
Experimental temperature :
-65℃~175 ℃
High and low temperature conversion rate:<5min
THT：Temperature Humidity Test
Experimental project ：
Constant temperature and constant humidity storage
Constant temperature storage
Constant humidity storage
Experimental ability:
Experimental temperature ：
-70℃~150 ℃
Experimental humidity：30%~100%RH
PCT：Pressure Cook Test
Experimental project ：
Pressure Cook
Experimental ability:
Experimental temperature ：121℃
Experimental humidity ：100%RH
Experimental pressure ：2atm
HTST：High Temperature Storage Life Test
Experimental project ：
High temperature storage
Experimental ability:
Experimental temperature ：≤260℃
Duration ：1000H
X-Ray：X Ray Detector System
Experimental project ：
Empty check of silver pulp
Testing of plastic sealing
Failure analysis
Experimental ability:
Ceiling voltage ：90KV
C-SAM：Scanning Acoustic Microscope
Experimental project ：
Crack detection in package structure
Internal layer detection of packaging structure
Defect detection of cavity, bubble and void in package structure
Experimental ability:
Point scan, block scan, layer scan
Through scan
IR Reflow Oven：Reflow soldering experiment
Experimental project ：
Simulation of the actual situation of SMT
Reliability test
Experimental ability:
6 temperature area
Maximum temperature area :300℃
Temperature difference :±2℃
